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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Converter Power Modules: 18-36V & 36-75Vdc Input; 1.0V-5Vdc Output; 4A-6A Output Current
RoHS Compliant
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z versions) Compliant to ROHS EU Directive 2002/95/EC with lead solder exemption (non-Z versions) Delivers up to 6A Output current 5V (4A), 3.3V (5A), 2.5V - 1.0V (6A each) High efficiency - 89% at 5.0V full load Low Output voltage- supports migration to future IC supply voltages down to 1.0V Low output ripple and noise
Applications
Wireless Networks Distributed power architectures Optical and Access Network Equipment Enterprise Networks Latest generation IC's (DSP, FPGA, ASIC) and Microprocessor powered applications
Small Size and low profile 47.2mm x 29.5mm x 8.5mm (1.86 x 1.16 x 0.335 in) Surface mount or Through hole (TH) Remote On/Off Output overcurrent/Over voltage protection Over temperature protection
Options
Remote On/Off logic (positive or negative) Surface Mount (-S Suffix) Additional Vout+ pin (-3 Suffix)
Single Tightly regulated output Output voltage adjustment trim 10% Wide operating temperature range (-40C to 85C) Meets the voltage insulation requirements for ETSI 300-132-2 and complies with and is Licensed for Basic Insulation rating per EN 60950 CE mark meets 73/23/EEC and 93/68/EEC directives UL* 60950-1Recognized, CSA C22.2 No. 60950-1 03 Certified, and VDE 0805:2001-12 (EN60950-1) Licensed ISO** 9001 and ISO 14001 certified manufacturing facilities
Description
The HW/HC series power modules are isolated dc-dc converters that operate over a wide input voltage range of 18 to 36 Vdc (HC) or 36 to 75 Vdc (HW) and provide one precisely regulated output. The output is fully isolated from the input, allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency, e.g. typical efficiency of 87% 3.3V/5A, 86% at 2.5V/6A. Built-in filtering for both input and output minimizes the need for external filtering. These open frame modules are available either in surface-mount (-S) or in through-hole form.
* UL is a registered trademark of Underwriters Laboratories, Inc.

CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards
Document No: DS03-017 ver.1.21 PDF No: hw-hc_4-6a.pdf
Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Input Voltage Continuous Transient (100ms) Operating Ambient Temperature (see Thermal Considerations section) Storage Temperature I/O Isolation Voltage (100% factory tested) All All Tstg -55 125 2250 C Vdc Device HC HW HW All Symbol VIN VIN VIN, trans TA Min -0.3 -0.3 -0.3 -40 Max 50 80 100 85 Unit Vdc Vdc Vdc C
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Operating Input Voltage Maximum Input Current (VIN=0V to 75V, IO=IO, max) Inrush Transient Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 12H source impedance; VIN=0V to 75V, IO= IOmax ; see Figure 9) Input Ripple Rejection (120Hz) EMC, EN55022 Device HC HW HC HW All All All Symbol VIN VIN IIN,max IIN,max It 5 50 See EMC Considerations section
2
Min 18 36
Typ 24 54
Max 36 75 1.75 0.85 1
Unit Vdc Vdc Adc Adc As mAp-p dB
2
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of complex power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fastacting fuse with a maximum rating of 3A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data sheet for further information.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Electrical Specifications (continued)
Parameter Output Voltage Set-point (VIN=VIN,nom, IO=IO, max, Tref=25C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range Selected by external resistor Output Regulation Line (VIN=VIN, min to VIN, max) Load (IO=IO, min to IO, max) Temperature (Tref=TA, min to TA, max) Output Ripple and Noise on nominal output (VIN=VIN, nom and IO=IO, min to IO, max) RMS (5Hz to 20MHz bandwidth) Peak-to-Peak (5Hz to 20MHz bandwidth) External Capacitance Output Current All All All 5V 3.3V 2.5V, 2.0, 1.8V, 1.5V, 1.2V, 1.0V Output Current Limit Inception ( Hiccup Mode ) 5V 3.3V 2.5V, 2.0V, 1.8V, 1.5V, 1.2V, 1.0V Output Short-Circuit Current (VO250mV) ( Hiccup Mode ) 5V 3.3V 2.5V, 2.0V, 1.8V, 1.5V, 1.2V, 1.0V CO, max Io Io Io IO, lim IO, lim IO, lim IO, s/c IO, s/c IO, s/c 0 0 0 6.5 7 8.5 2.4 2.4 2.8 8 25 15 50 470 4.0 5.0 6.0 mVrms mVpk-pk F Adc Adc Adc Adc Adc Adc A rms A rms A rms All All All 10 15 1.00 mV mV % All VO -10.0 +10.0 % VO, nom Device 5V, 3.3V 2.5V, 2.0V, 1.8V, 1.5V 1.2V, 1.0V All Symbol VO, set VO, set VO Min -1.0 -1.25 -3.0 Typ Max +1.0 +1.25 +3.0 Unit % VO, nom % VO, nom % VO, nom
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Electrical Specifications (continued)
Parameter Efficiency VIN=VIN, nom, TA=25C IO=IO, max , VO= VO,set Device HW 5V HW 3.3V HW 2.5V HW 2.0V HW 1.8V HW 1.5V HW 1.2V HW 1.0V HC 5V HC 3.3V Switching Frequency Dynamic Load Response (Io/t=1A/s; Vin=Vin,nom; TA=25C) Load Change from Io= 50% to 75% of Io,max: Peak Deviation Settling Time (Vo<10% peak deviation) Dynamic Line Response (Vin / t0.5V/s; Vin=Vin,nom; TA=25C) Peak Deviation Settling Time (Vo<10% peak deviation) All All Vpk ts 0.6 150 2 1000 %Vo, set s All ts 100 s 5V, 3.3V 2.5V, 2.0V, 1.8V, 1.5V, 1.2V, 1.0V Vpk Vpk 100 80 mV mV All HW All HC Symbol fsw fsw Min Typ 89.0 87.0 86.0 82.0 82.0 80.0 77.0 75.0 88.0 86.0 300 380 Max Unit % % % % % % % % % % kHz kHz
Isolation Specifications
Parameter Isolation Capacitance Isolation Resistance Symbol Ciso Riso Min 10 Typ 200 Max Unit pF M
General Specifications
Parameter Calculated MTBF (for HW005A0F1-S in accordance with Lucent RIN 6: IO=80% of IO, max, TA=25C, airflow=1m/s) Weight Min Typ >4,000,000 13 Max Unit Hours g (oz.)
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information.
Parameter Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix "1" Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low Specification Remote On/Off Current - Logic Low On/Off Voltage: Logic Low Logic High - (Typ = Open Collector) Logic High maximum allowable leakage current Turn-On Delay and Rise Times (IO=IO, max) Tdelay = Time until VO = 10% of VO,set from either application of Vin with Remote On/Off set to On or operation of Remote On/Off from Off to On with Vin already applied for at least one second. Trise = time for VO to rise from 10% of VO,set to 90% of VO,set.
Device
Symbol
Min
Typ
Max
Unit
All All All All
Ion/off Von/off Von/off Ion/off
0.0
0.15 5.8
1.0 1.2 15 10
mA V V A
5V, 3.3V
Tdelay Trise

100 40

ms ms
2.5V, 2.0V, 1.8V, 1.5V, 1.2V, 1.0V
Tdelay Trise VO, limit

12 3 125
7.0 4.6 3.5 3.2 2.8 2.5 2.0 1.8
ms ms V V V V V V V V C
5V Output Overvoltage Protection
#
3.3V 2.5V 2.0V 1.8V 1.5V 1.2V 1.0V
Values are the same for HW and HC codes
Overtemperature Protection (See Feature Descriptions) Input Undervoltage Lockout Turn-on Threshold Turn-off Threshold Turn-on Threshold Turn-off Threshold
All
Tref
All HW All HW All HC All HC
27 13.5
33 30 17 15
36 18
V V V V
# More accurate Overvoltage protection can be accomplished externally by means of the remote On/Off pin.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Characteristic Curves
The following figures provide typical characteristics for the HW004A0A (5.0V, 4A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
90 88
5
OUTPUT CURRENT, Io (A)
86
4
EFFICIENCY, (%)
84 82 80 78 76 74 72 70 0 1 2 3 4 V I = 36V V I = 54V V I = 75V
3
2
1
3.0 m/s (600 ft./min.) 2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) NATURAL CONVECTION
0 0 1 0 20 30 40 50 60 70 80 90
O
100
110
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 1. Converter Efficiency versus Output Current
Figure 4. Derating Output Current versus Local Ambient Temperature and Airflow
OUTPUT VOLTAGE INPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (50V/div)
VO (V) (2V/div)
TIME, t (1s/div)
TIME, t (20ms/div)
Figure 2. Typical Output Ripple and Noise.
Figure 5. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
On/Off VOLTAGE OUTPUT VOLTAGE
VO (V) (50mV/div)
IO (A) (1A/div)
VON/OFF(V) (5V/div)
VO (V) (2V/div)
TIME, t (50s/div)
TIME, t (20ms/div)
Figure 3. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 6. Typical Start-Up Using Remote On/Off, negative logic version shown.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW005A0F (3.3V, 5A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
90 88 86
6
84 82 80 78 76 74 72 70 0 1 2 3 4 5 V I = 36V V I = 54V V I = 75V
OUTPUT CURRENT, Io (A)
5 4 3 2 1 0 0 10 20 30 40 50 60 70 80
O
EFFICIENCY, (%)
3.0 m/s (600 ft./min.) 2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) NATURAL CONVECTION
90
100
110
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 7. Converter Efficiency versus Output Current
Figure 10. Derating Output Current versus Local Ambient Temperature and Airflow
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (50V/div)
VO (V) (1V/div)
TIME, t (1s/div)
TIME, t (20ms/div)
Figure 8. Typical Output Ripple and Noise.
Figure 11. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
OUTPUT VOLTAGE On/Off VOLTAGE
VO (V) (50mV/div)
VON/OFF(V) (5V/div)
IO (A) (2A/div)
VO (V) (1V/div)
TIME, t (50s/div)
TIME, t (20ms/div)
Figure 9. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 12. Typical Start-Up Using Remote On/Off, negative logic version shown.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0G (2.5V, 6A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
88 86 84
7
OUTPUT CURRENT, Io (A)
6 5 4 3 2 1 0 0 10 20 30 40 50 60 70 80
O
EFFICIENCY, (%)
82 80 78 76 74 72 70 68 0 1 2 3 4 5 6 V I = 36V V I = 54V V I = 75V
2.0 m/ s (400 f t./ min.) 1.0 m/ s (200 f t./ min.) NATURAL CONVECTION
90
100
110
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 13. Converter Efficiency versus Output Current.
Figure 16. Derating Output Current versus Local Ambient Temperature and Airflow.
OUTPUT VOLTAGE INPUT VOLTAGE,
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (50V/div)
VO (V) (1V/div)
TIME, t (1s/div)
TIME, t (5ms/div)
Figure 14. Typical Output Ripple and Noise.
Figure 17. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
OUTPUT VOLTAGE On/Off VOLTAGE,
VO (V) (50mV/div)
VON/OFF(V) (5V/div)
IO (A) (2A/div)
VO (V) (1V/div)
TIME, t (50s/div)
TIME, t (5ms/div)
Figure 15. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 18. Typical Start-Up Using Remote On/Off, negative logic version shown.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0D (2.0V, 6A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
88 86 84
7
OUTPUT CURRENT, Io (A)
6 5 4 3 2 1 0 0 10 20 30 40 50 60 70 80
O
EFFICIENCY, (%)
82 80 78 76 74 72 70 68 0 1 2 3 4 5 6 V I = 36V V I = 54V V I = 75V
2.0 m/ s (400 f t./ min.) 1.0 m/ s (200 f t./ min.) NATURAL CONVECTION
90
100
110
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 13. Converter Efficiency versus Output Current.
Figure 16. Derating Output Current versus Local Ambient Temperature and Airflow
OUTPUT VOLTAGE INPUT VOLTAGE,
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (50V/div)
VO (V) (1V/div)
TIME, t (1s/div)
TIME, t (5ms/div)
Figure 14. Typical Output Ripple and Noise.
Figure 17. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
OUTPUT VOLTAGE On/Off VOLTAGE,
VO (V) (50mV/div)
VON/OFF(V) (5V/div)
IO (A) (2A/div)
VO (V) (1V/div)
TIME, t (50s/div)
TIME, t (5ms/div)
Figure 15. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 18. Typical Start-Up Using Remote On/Off, negative logic version shown.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0Y (1.8V, 6A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
86 84 82
7
OUTPUT CURRENT, Io (A)
6 5 4 3 2 1 0 0 10 20 30 40 50 60 70 80 90
O
EFFICIENCY, (%)
80 78 76 74 72 70 68 66 0 1 2 3 4 5 6 V I = 36V V I = 54V V I = 75V
2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) NATURAL CONVECTION
100
110
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 25. Converter Efficiency versus Output Current
Figure 28. Derating Output Current versus Local Ambient Temperature and Airflow
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (25V/div)
VO (V) (500mV/div)
TIME, t (1s/div)
TIME, t (5ms/div)
Figure 26. Typical Output Ripple and Noise.
Figure 29. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
OUTPUT VOLTAGE On/Off VOLTAGE,
VON/OFF(V) (5V/div)
IO (A) (2A/div)
VO (V) (500mV/div)
VO (V) (50mV/div)
TIME, t (50s/div)
TIME, t (5ms/div)
Figure 27. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 30. Typical Start-Up Using Remote On/Off, negative logic version shown.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0M (1.5V, 6A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
86 84 82
7
OUTPUT CURRENT, Io (A)
6 5 4 3 2 1 0 0 10 20 30 40 50 60 70 80
O
EFFICIENCY, (%)
80 78 76 74 72 70 68 66 0 1 2 3 4 5 6 V I = 36V V I = 54V V I = 75V
2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) NATURAL CONVECTION
90
100
110
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 31. Converter Efficiency versus Output Current.
Figure 34. Derating Output Current versus Local Ambient Temperature and Airflow
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (25V/div)
VO (V) (500mV/div)
TIME, t (1s/div)
TIME, t (5ms/div)
Figure 32. Typical Output Ripple and Noise.
Figure 35. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
OUTPUT VOLTAGE On/Off VOLTAGE,
VON/OFF(V) (5V/div)
IO (A) (2A/div)
VO (V) (500mV/div)
VO (V) (50mV/div)
TIME, t (50s/div)
TIME, t (5ms/div)
Figure 33. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 36. Typical Start-Up Using Remote On/Off, negative logic version shown.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0P (1.2V, 6A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
80 78 76
7
OUTPUT CURRENT, Io (A)
6 5 4 3 2 1 0 0 10 20 30 40 50 60 70 80
O
EFFICIENCY, (%)
74 72 70 68 66 64 62 60 0 1 2 3 4 5 6 V I = 36V V I = 54V V I = 75V
3.0 m/s (600 ft ./min.) 2.0 m/s (400 ft ./min.) 1.0 m/s (200 ft ./min.) NATURAL CONVECTION
90
100
110
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 37. Converter Efficiency versus Output Current.
Figure 40. Derating Output Current versus Local Ambient Temperature and Airflow
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (50V/div)
VO (V) (500mV/div)
TIME, t (1s/div)
TIME, t (5ms/div)
Figure 38. Typical Output Ripple and Noise.
Figure 41. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
On/Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div)
IO (A) (2A/div)
VO (V) (500mV/div)
VO (V) (50mV/div)
TIME, t (50s/div)
TIME, t (5ms/div)
Figure 39. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 42. Typical Start-Up Using Remote On/Off, negative logic version shown.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0S1R0 (1.0V, 6A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
80 78 76
7
OUTPUT CURRENT, Io (A)
6 5 4 3 2 1 0 0 10 20 30 40 50 60 70 80
O
EFFICIENCY, (%)
74 72 70 68 66 64 62 60 0 1 2 3 4 5 6 VI = 36V VI = 54V VI = 75V
3.0 m/s (600 f t./ min.) 2.0 m/s (400 f t./ min.) 1.0 m/s (200 f t./ min.) NATURAL CONVECTION
90
100
110
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 43. Converter Efficiency versus Output Current.
Figure 46. Derating Output Current versus Local Ambient Temperature and Airflow.
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (50V/div)
VO (V) (500mV/div)
TIME, t (1s/div)
TIME, t (5ms/div)
Figure 44. Typical Output Ripple and Noise.
Figure 47. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
On/Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div)
IO (A) (2A/div)
VO (V) (500mV/div)
VO (V) (50mV/div)
TIME, t (50s/div)
TIME, t (5ms/div)
Figure 45. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 48. Typical Start-Up Using Remote On/Off, negative logic version shown.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Characteristic Curves (continued)
The following figures provide typical characteristics for the HC004A0A (5.0V, 4A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
5
OUTPUT CURRENT, Io (A)
4
EFFICIENCY, (%)
3
2
1
3.0 m/ s (600 ft ./min.) 2.0 m/ s (400 ft ./min.) 1.0 m/ s (200 ft ./min.) Nat ural Convection
0 0 10 20 30 40 50 60 70 80
O
90
100
110
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 49. Converter Efficiency versus Output Current.
Figure 52. Derating Output Current versus Local Ambient Temperature and Airflow.
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (25V/div)
VO (V) (2V/div)
TIME, t (1s/div)
TIME, t (20ms/div)
Figure 50. Typical Output Ripple and Noise.
Figure 53. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
On/Off VOLTAGE, OUTPUT VOLTAGE
VO (V) (50mV/div)
VON/OFF(V) (5V/div)
IO (A) (1A/div)
VO (V) (2V/div)
TIME, t (50s/div)
TIME, t (20ms/div)
Figure 51. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 54. Typical Start-Up Using Remote On/Off, negative logic version shown.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Characteristic Curves (continued)
The following figures provide typical characteristics for the HC005A0F (3.3V, 5A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
6
OUTPUT CURRENT, Io (A)
5 4 3 2 1 0 0 10 20 30 40 50 60 70 80 90
O
EFFICIENCY, (%)
3.0 m/ s (600 ft ./min.) 2.0 m/ s (400 ft ./min.) 1.0 m/ s (200 ft ./min.) Nat ural Convection
100
110
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 55. Converter Efficiency versus Output Current.
Figure 58. Derating Output Current versus Local Ambient Temperature and Airflow.
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (25V/div)
VO (V) (1V/div)
TIME, t (1s/div)
TIME, t (20ms/div)
Figure 56. Typical Output Ripple and Noise.
Figure 59. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
On/Off VOLTAGE, OUTPUT VOLTAGE
VO (V) (50mV/div)
VON/OFF(V) (5V/div)
IO (A) (2A/div)
VO (V) (1V/div)
TIME, t (50s/div)
TIME, t (20ms/div)
Figure 57. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 60. Typical Start-Up Using Remote On/Off, negative logic version shown.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Test Configurations
TO OSCILLOSCOPE LTEST Vin+ 12H CURRENT PROBE
Design Considerations
Input Source Impedance
The power module should be connected to a low ac-impedance source. A highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 61, a 33F electrolytic capacitor (ESR<0.7 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines.
BATTERY
CS
220F
33F
E.S.R.<0.1 @ 20C 100kHz Vin-
NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 12H. Capacitor CS offsets possible battery impedance. Measure current as shown above.
Safety Considerations
For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE 0805:2001-12 (IEC60950-1). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module's output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true:
The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. One VIN pin and one VOUT pin are to be grounded, or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible.
Figure 61. Input Reflected Ripple Current Test Setup.
COPPER STRIP VO (+) 1uF . V O (-) 10uF SCOPE RESISTIVE LOAD
GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
Figure 62. Output Ripple and Noise Test Setup.
Rdistribution
Rcontact Vin+ Vout+
Rcontact
Rdistribution
VIN
VO
RLOAD
Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module's output.
Rdistribution
Rcontact VinVout-
Rcontact
Rdistribution
NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
Figure 63. Output Voltage and Efficiency Test Setup.
VO. IO Efficiency = VIN. IIN x 100 %
Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. For input voltages exceeding -60 Vdc but less than or equal to -75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. "All flammable materials used in the manufacturing of these modules are rated 94V-0 and UL60950 A.2 for reduced thicknesses. The input to these units is to be provided with a maximum 3A fast-acting fuse in the unearthed lead."
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix "1", turns the module off during a logic high and on during a logic low. To maintain compatibility with LW series power modules the Remote On/Off pin is optional for the TH (through hole) version. Standard TH modules have no On/Off pin fitted. TH modules ordered with device code suffix "1" are negative logic with the On/Off pin fitted.
only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON. Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, VUV/OFF.
Over Voltage Protection
The output overvoltage protection consists of circuitry that internally clamps the output voltage. If a more accurate output overvoltage protection scheme is required then this should be implemented externally via use of the remote on/off pin.
Over Temperature Protection
VIN(+)
Ion/off ON/OFF
VO
To provide protection in a fault condition, the unit is equipped with a thermal shutdown circuit. The unit will o shutdown if the overtemperature threshold of 125 C is exceeded at the thermal reference point Tref . Once the unit goes into thermal shutdown it will then wait to cool before attempting to restart.
Von/off
COM
Output Voltage Programming
Trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin (COM pin) .
VIN(+) VO(+) Rtrim-up ON/OFF VOTRIM Rtrim-down VIN(-) COM LOAD
VIN(-)
Figure 64. Remote On/Off Implementation. To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VIN(-) terminal. Logic low is 0V Von/off 1.2V. The maximum Ion/off during a logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current. During a logic high, the typical Von/off generated by the module is 5.8V, and the maximum allowable leakage current at Von/off = 5.8V is 10A. If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to VIN(-).
Overcurrent Protection
To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. The unit operates normally once the output current is brought back into its specified range. The average output current during hiccup is 10% IO, max.
Figure 65. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (Rtrim-down) between the TRIM pin and the COM pin decreases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be 0.1%.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Feature Descriptions (continued)
The relationship between the output voltage and the trim resistor value for a % reduction in output voltage is: Rtrim-down = 249.39 k Nominal 5V, 3.3V, 2.5V, 2.0V, 1.8V, & 1.5V modules: 511 Rtrim-down = Nominal 1.2V module: 346 Rtrim-down = Nominal 1.0V module: 390 Rtrim-down = % - 4.90 k % - 4.46 k Rtrim-up =94.2 k % - 6.11 k To trim up the output of a nominal 3.3V module (HW005A0F) to 3.63V % = 10 5.11x3.3(100+10) Rtrim-up = 1.225x10 511 10 - 6.11 k
Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) pin increases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be 0.5%. The relationship between the output voltage and the trim resistor value for a % increase in output voltage is: Nominal 5V, 3.3V, 2.5V, 2.0V, 1.8V, & 1.5V modules: 5.11VO(100+%) 1.225% 511 % - 6.11 k
Rtrim-up =
Nominal 1.2V module: 5.11VO(100+%) 1.225% 346 % - 4.46 k
Rtrim-up =
Nominal 1.0V module: Rtrim-up = 5.11VO(100+%) 1.225% 390 % - 4.90 k
(VO refers to the nominal output voltage, i.e. 5.0V for VO on an HW004A0A. % is the required % change in output voltage, i.e. to trim a 5.0V module to 5.10V the % value is 2). Examples: To trim down the output of a nominal 5.0V module (HW004A0A) to 4.90V % = 2 511 2 LINEAGE POWER Rtrim-down = - 6.11 k 18
Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Thermal Considerations
The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The thermal reference point, Tref used in the specifications is shown in Figure 66. For reliable operation this temperature should not exceed 115 oC.
C1 0.68uF C2 0.68uF L2 10uH
C5 56nF Vin+ C4 33uF 100V VinVout+
C3 0.68uF
HW005 Vout-
L1 - CMC Pulse P0354 C6 56nF
Figure 67. Suggested Configuration for EN55022 Class B.
90 80 70 60 EN 55022 Class B Conducted Average dBuV 50 40 30 Level (dBV) 20 10 100K Frequency(Hz) 500K 1M 5M 10M 30M
Figure 66. Tref Temperature Measurement Location. Please refer to the Application Note "Thermal Characterization Process For Open-Frame BoardMounted Power Modules" for a detailed discussion of thermal aspects including maximum device temperatures.
Figure 68. EMC signature using above filter,
HW005A0F. For further information on designing for EMC compliance, please refer to the FLTR100V10 data sheet (FDS01-043EPS).
Layout Considerations
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer via convection. Derating figures showing the maximum output current that can be delivered by each module versus local ambient temperature (TA) for natural convection and up to 3m/s (600 ft./min) are shown in the respective Characteristics Curves section. The HW/HC005 power module series are low profile in order to be used in fine pitch system card architectures. As such, component clearance between the bottom of the power module and the mounting board is limited. Avoid placing copper areas on the outer layer directly underneath the power module. Also avoid placing via interconnects underneath the power module. For additional layout guide-lines, refer to FLTR100V10 data sheet.
EMC Considerations
The figure 67 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Mechanical Outline for HW/HC Surface-Mount Module
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.)
47.2 (1.860)
Top View
29.5 (1.162)
Side View
2.54 (0.100) min stand-off height
8.50 (0.335) MAX
0.5 (.020) max compliance
Bottom View
10.00 (0.394) 123 26.16 (1.031) 18 17 1.65 (0.065) 3.63 (0.143)
40.00 (1.576) PIN 3 OPTIONAL 9
Pin
1 2 3 9 11 17 18
Function
Vout + Vout Standard = No Pin Optional = Vout + Trim On/Off Vin Vin +
11 5.00 (0.197) 35.00 (1.379)
LINEAGE POWER
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Mechanical Outline for HW/HC Through Hole Module
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.)
47.2 (1.860)
Top View
29.5 (1.162)
Side View
* Optional pin lengths shown in Table 2 Device Options
Bottom View
40.00 (1.576)
Pin
1 2 9 11 17 18
Function
Vout + Vout Trim On/Off Vin Vin +
1 26.16 (1.031)
2
9
18 17 1.65 (0.065) 3.63 (0.143) 5.00 (0.197) 35.00 (1.379)
11
LINEAGE POWER
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Recommended Pad Layout for Surface Mount and Through Hole Module
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.)
Pin
1 2 3 9 11 17 18
Function
Vout + Vout Standard = No Pin Optional = Vout + Trim On/Off Vin Vin +
Surface Mount Pad Layout - Component side view
Pin
1 2 9 11 17 18
Function
Vout + Vout Trim On/Off Vin Vin +
Through-Hole Pad Layout - Component side view
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Packaging Details
The surface mount versions of the HW005 family are also available in tape & reel (suffix -SR) as an option. Detailed of tape dimensions are shown below. Modules are shipped in quantities of 115 per reel. Tape Dimensions Dimensions are in millimeters and (inches).
PICK POINT
4.00 (0.157)
40.00 (1.575)
9.02 (0.355)
34.20 (1.346)
FEED DIRECTION
72.00 (2.834) 68.40 (2.692)
66.50 (2.692)
TOP COVER TAPE
EMBOSSED CARRIER
NOTE: CONFORMS TO EAI-481 REV. A STANDARD
Reel Dimensions Outside diameter: Inside diameter: Tape Width:
330.2 mm (13.00") 177.8 mm (7.00") 72.00 mm (2.834")
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Through-Hole Lead-Free Soldering Information
The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power representative for more details.
Figure 69. Surface Mount Packaging Tray Tray Specification
Material Max surface resistivity Color Capacity Min order quantity Antistatic coated PVC 1012/sq Clear 15 power modules 60 pcs (1 box of 4 full trays)
Surface Mount Information
Packaging Details
The surface mount versions of the HW005 family (suffix -S) are supplied as standard in the plastic tray shown in Figure 69. The tray has external dimensions of 135.1mm (W) x 321.8mm (L) x 12.4mm (H) or 5.319in (W) x 12.669in (L) x 0.489in (H). Surface mount versions of the HW005 family are also available as an option packaged in Tape and Reel. For further information on this please contact your local Lineage Power Technical Sales Representative.
Each tray contains a total of 15 power modules. The trays are self-stacking and each shipping box will contain 4 full trays plus one empty hold down tray giving a total number of 60 power modules.
Pick and Place
The HW005-S series of DC-to-DC power converters use an open-frame construction and are designed for surface mount assembly within a fully automated manufacturing process. The HW005-S series modules are fitted with a Kapton label designed to provide a large flat surface for pick and placing. The label is located covering the Centre of Gravity of the power module. The label meets all the requirements for surface-mount processing, as well as meeting UL safety agency standards. The label will withstand reflow temperatures up to 300C. The label also carries product information such as product code, date and location of manufacture.
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Surface Mount Information (continued)
24.2
damage to the modules, and can adversely affect long-term reliability. The surface mountable modules in the HW005 family use our newest SMT technology called "Column Pin" (CP) connectors. Fig 71 shows the new CP connector before and after reflow soldering onto the end-board assembly.
HW005 Board
COG
12.7
8.0
14.7
Insulator
19.0
9.5
Solder Ball End assembly PCB
Note: All dimensions in mm. Figure 70. Pick and Place Location. Z Plane Height The `Z' plane height of the pick and place location is 7.50mm nominal with an RSS tolerance of +/-0.25 mm.
Figure 71. Column Pin Connector Before and After Reflow Soldering. The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder. The CP connector design is able to compensate for large amounts of co-planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183oC, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures.
300
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Even so, they have a relatively large mass when compared with conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. For further information please contact your local Lineage Power Technical Sales Representative.
P eak Temp 235oC
250
REFLOW TEMP (C)
Reflow Soldering Information
The HW005 family of power modules is available for either Through-Hole (TH) or Surface Mount (SMT) soldering. These power modules are large mass, low thermal resistance devices and typically heat up slower than other SMT components. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause
200
Heat zo ne max 4oCs -1
Co o ling zo ne 1 oCs -1 -4
150
100
So ak zo ne 30-240s P reheat zo ne max 4oCs -1
Tlim above 205oC
50
0
REFLOW TIME (S)
Figure 72. Recommended Reflow Profile
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40 C, < 90% relative humidity.
Surface Mount Information (continued)
240 235
MAX TEMP SOLDER (C)
230 225 220 215 210 205 200 0 10 20 30 40 50 60
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AP01-056EPS).
300 Per J-STD-020 Rev. C Peak Temp 260C 250
TIME LIMIT (S)
Figure 73. Time Limit Curve Above 205oC Reflow .
Reflow Temp (C)
Lead Free Soldering
The -Z version SMT modules of the HW/HC series are lead-free (Pb-free) and RoHS compliant and are compatible in a Pb-free soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. Pb-free Reflow Profile Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure. 74.
200 * Min. Time Above 235C 15 Seconds 150 Heating Zone 1C/Second 100 *Time Above 217C 60 Seconds
Cooling Zone
50
0
Reflow Time (Seconds)
Figure 74. Recommended linear reflow profile using Sn/Ag/Cu solder.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet the solder ball requirements per J-STD-001B. These requirements state that solder balls must neither be loose nor violate the power module minimum electrical spacing. The cleanliness designator of the open frame power module is C00 (per J specification).
MSL Rating
The HW/HC series SMT modules have a MSL rating of 1.
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of 30C and 60% relative humidity varies according to the MSL rating (see J-STD-033A).
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features. Table 1. Device Codes Product codes HW004A0A-S HW004A0A-SZ HW004A0A1 HW004A0A1-S HW004A0A1Z HW004A0A1-SB HW004A0A1-SZ HW005A0F-S HW005A0F-SZ HW005A0F-SR39* HW005A0F1 HW005A0F1Z HW005A0F1-S HW005A0F1-SZ HW005A0F1-SRZ HW005A0F1-S65* HW005A0F1-S65Z* HW006A0G1-SZ HW006A0D1-S HW006A0D1-SZ HW006A0Y1-S HW006A0Y1-SZ HW006A0P1-SZ HC004A0A1-S HC004A0A1-SZ HC005A0F1-S HC005A0F1-SZ Input Voltage 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 48 Vdc 24 Vdc 24 Vdc 24 Vdc 24 Vdc Output Voltage 5.0V 5.0V 5.0V 5.0V 5.0V 5.0V 5.0V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 2.5V 2.0V 2.0V 1.8V 1.8V 1.2V 5.0V 5.0V 3.3V 3.3V Output Current 4A 4A 4A 4A 4A 4A 4A 5A 5A 5A 5A 5A 5A 5A 5A 5A 5A 6A 6A 6A 6A 6A 6A 4A 4A 5A 5A Remote On/Off Logic Positive Positive Negative Negative Negative Negative Negative Positive Positive Positive Negative Negative Negative Negative Negative Negative Negative Negative Negative Negative Negative Negative Negative Negative Negative Negative Negative Connector Type SMT SMT Through-Hole SMT Through-Hole SMT SMT SMT SMT SMT (tape & reel) Through-Hole Through-Hole SMT SMT SMT (tape&reel) SMT SMT SMT SMT SMT SMT SMT SMT SMT SMT SMT SMT Comcodes 108968272 109100245 108965476 108960634 CC109102002 108980525 109100237 108968678 109100261 108986951 108967779 CC109107125 108960667 108995197 109100253 108987512 108995206 109100311 108969676 109100303 108960782 109100344 109100336 108960642 108996113 108960659 108996121
LINEAGE POWER
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Data Sheet May 16, 2008
HW/HC004/005/006 Series DC-DC Power Module: 18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
Table 2. Device Options Option Negative remote on/off logic With additional Vout+ pin3 Short Pins: 3.68 mm 0.25 mm (0.145 in 0.010 in) Short Pins: 2.79 mm 0.25 mm (0.110 in 0.010 in) Customer specific Customer specific Tape & Reel Surface mount connections RoHS Compliant Suffix 1 3 6 8 -39 -65 -R -S -Z
* Please contact Lineage Power for availability of these options, samples, minimum order quantity and lead times
Asia-Pacific Headquarters Tel: +65 6416 4283 Europe, Middle-East and Africa Headquarters Tel: +49 89 6089 286 India Headquarters Tel: +91 80 28411633
World Wide Headquarters Lineage Power Corporation 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 (Outside U.S.A.: +1-972-284-2626) www.lineagepower.com e-mail: techsupport1@lineagepower.com
Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. Document No: DS03-017 ver.1.21 (c) 2008 Lineage Power Corporation, (Mesquite, Texas) All International Rights Reserved.
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